16mm Clear PS ESD Carrier Tape for SMT SMD Component Packaging

Custom Embossed Carrier Tape PS PET PC for IC Semiconductor SMT Packaging

Typical Applications

The carrier tape can be configured for different electronic component packages and automated assembly requirements, including:

• Chip Resistors
• MLCC Capacitors
• SMD LEDs
• Diodes
• Transistors
• IC Components
• QFN / DFN Packages
• Connectors
• Sensors
• Semiconductor Components
• Other Customized SMD Devices

For components with special dimensions or irregular package configurations, the pocket geometry can be developed according to the customer's component drawing or physical sample.

Why Choose a Customized Carrier Tape?

Different electronic components require different pocket dimensions, cavity depths and pitches. A carrier tape designed specifically for the component can provide better positioning and feeding performance than a standard tape that does not match the package geometry.

For customized projects, the engineering process can start from a component sample, dimensional drawing, package specification or existing carrier tape sample. The pocket structure is then developed around the actual component dimensions and packaging requirements.

This allows important details such as pocket size, cavity depth, pitch, component positioning and tape configuration to be evaluated before volume production.