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Home > Products > ESD Products > ESD Aluminum Foil Bag Moisture Barrier Bag for Semiconductor Electronic Component Packaging
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ESD Aluminum Foil Bag Moisture Barrier Bag for Semiconductor Electronic Component Packaging
ESD Aluminum Foil Bag Moisture Barrier Bag for Semiconductor Electronic Component Packaging

ESD Aluminum Foil Bag Moisture Barrier Bag for Semiconductor Electronic Component Packaging

Product Details

Place of Origin: China

Brand Name: ACE DELIXIN

Certification: SGS

Model Number: Aluminum Foil Bag

Payment & Shipping Terms

Minimum Order Quantity: Accroding to the demand

Price: USD(0.1-10)/pc

Packaging Details: 10pcs/bag 50pcs/bag 100pcs/bag

Delivery Time: 5-8 Working days

Payment Terms: T/T, Western Union

Get Best Price

Product Details

Product Description
Highlight:
Color:
Or As Required
Material:
PE Film,antistatic Plastic
Feature:
Anti-static
Size:
Match With Garment
Product Name:
Anti Static Shielding Bags
Application:
Clean Room
Color:
Or As Required
Material:
PE Film,antistatic Plastic
Feature:
Anti-static
Size:
Match With Garment
Product Name:
Anti Static Shielding Bags
Application:
Clean Room
ESD Aluminum Foil Bag Moisture Barrier Bag for Semiconductor Electronic Component Packaging

Static Shielding Aluminum Foil Bag Vacuum Moisture Barrier Packaging Bag for IC Components

 

ESD Moisture Barrier Aluminum Foil Bag

The ESD Moisture Barrier Aluminum Foil Bag is specially designed for moisture-sensitive and static-sensitive products requiring high-performance protection during storage and transportation.

The bag adopts a four-layer composite structure of PET/AL/PA/PE, combining excellent mechanical strength, moisture resistance, oxygen barrier performance, and electrostatic protection. The aluminum foil layer provides superior shielding performance, effectively preventing external moisture, oxygen, and static interference from affecting sensitive electronic products.

 

No. Test Item Test Method Unit Typical Value
1 Lamination‑Structure Material Specification Micrometer / Microscope μm PET12/AL7/PA15/PE110
2 ESD‑Static‑Dissipation Performance ASTM D257 / IEC 61340‑2‑3 Ω/sq 10⁸ ~ 10¹¹
3 Moisture Vapor Transmission Rate (MVTR) ASTM F1249 / GB/T 26253 (38 °C,90%RH) g/m²·24h ≤ 0.05
4 Oxygen Transmission Rate (OTR) ASTM D3985 / GB/T 19789 (23 °C,0%RH) cm³/m²·24h ≤ 0.05
5 Heat Sealability Heat‑seal Tester / Tensile‑testing Machine N/15mm ≥ 25
6 Puncture Strength ASTM D1709 / GB/T10004 N ≥ 35
7 Sealing‑Temperature Range ‑ °C 160 ~ 200
8 Heat‑seal Time ‑ s 0.5 ~ 2.0

 

ESD Aluminum Foil Bag Moisture Barrier Bag for Semiconductor Electronic Component PackagingESD Aluminum Foil Bag Moisture Barrier Bag for Semiconductor Electronic Component Packaging

Tags:

anti static products,

esd protection products,

Anti Static Ball Point Pen

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